邱阳 副教授
邮箱：yangqiu826@shu.edu.cn
澳门永利yl6776
导师介绍：
从事芯片封装和微机电系统的研究。近年来为加拿大IBM开发下一代面向高性能计算的异质集成技术。在相关领域发表SCI论文9篇，主持和参与了加拿大工程研究院及海外企业的多个研究项目。2020年入选上海海外高层次人才引进计划。
招收微电子、机械工程、光电子、应用物理等相关专业背景的硕士研究生。
研究方向：
芯片封装、微机电系统、微纳光电子器件
教育背景：
2019年博士毕业于加拿大阿尔伯塔大学大学机械工程学专业
2014年硕士毕业于华中科技大学机械制造及其自动化专业
2011年本科毕业于武汉理工大学机械制造及其自动化专业
工作经历：
2022年1月-至今 澳门永利yl6776 副教授
2019年09月-2021年09月 加拿大3IT研究所和IBM 博后研究员
2018年09月-2019年05月 加拿大Teledyne Micralyne Inc. 安全巡视员
科研成果及获奖情况：
2020年02月-2021年08月 加拿大Mitacs加速实习奖 （40000加币/年）
2014年09月-2017年08月 加拿大阿尔伯塔创新科技未来奖学金（31500加币/年）
近五年代表性论文：
1. Yang Qiu, Mohammad Mahdi Honari*, Mohammad Saeid Ghaffarian, Pedram Mousavi, "Design and Fabrication of Non-Planar Yagi-Uda Antennas Based on A New Partially Conductive Filling Method", IEEE Antennas and Wireless Propagation Letters, 2019/11, Volume 18, Issue 11, PP 2439-2443, DOI: 10.1109/LAWP.2019.2937275
2. Han Su, Huiyong Hu*,Yang Qiu, Pedram Mousavi, "Performance Analysis of Silicon-based Frequency Reconfigurable Monopole", Microsystem Technologies, 2019/2, PP 1-5, DOI 10.1007/s00542-019-04345-y
3. Yang Qiu*, Mohammad Mahdi Honari, Teng Zhang, Shichao Yue, Walied Moussa, Pedram Mousavi, "Conductive Polymer Metallized Vias: A New Approach for Substrate Integrated Waveguide Development", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018/11, Volume 9, Issue 6, PP 1111-1118, DOI 10.1109/TCPMT.2018.2879447
4. Shichao Yue,Yang Qiu, Walied Moussa*, "Packaging Induced Range Tunability of Tactile Sensors for Physiological Signal Monitoring Applications", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018/4, Volume 8, Issue 4, PP 588-596, DOI 10.1109/TCPMT.2018.2810738
5. Shichao Yue,Yang Qiu, Walied Moussa*, "A Multi-Axis Tactile Sensor Array for Touchscreen Applications", IEEE Journal of Microelectromechanical Systems, 2018/4, Volume 27, Issue 2, PP 179-189, DOI 10.1109/JMEMS.2017.2778572
6. Yang Qiu, Shichao Yue, Walied Moussa*, Pedram Mousavi, "Development of Embedded Redistribution Layer based Silicon Interposer for 3D Integration", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018/3, Volume 8, Issue 3, PP 399-409, DOI 10.1109/TCPMT.2018.2794202
7. Yang Qiu, Shichao Yue, Walied Moussa*, Pedram Mousavi, "Vacuum-assisted Through Silicon Via Filling Method with Ag-based Epoxy", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016/10, Volume 6, Issue 10, PP 1475-1481, DOI 10.1109/TCPMT.2016.2610321
8. Shu Cao,Yang Qiu, Xingfang Wei, Honghai Zhang*, "Experimental and Theoretical Investigation on Ultra-thin Powder Layering in Three-Dimensional Printing (3DP) by a Novel Double-smoothing Mechanism", Journal of Materials Processing Technology, 2015/6, Volume 220, PP 231-242, DOI 10.1016/j.jmatprotec.2015.01.016
9. Zhenjun Sun, Bo Ye,Yang Qiu, Xingguo Cheng, Honghai Zhang, Sheng Liu*, "Preliminary Study of a Legged Capsule Robot Actuated Wirelessly by Magnetic Torque", IEEE Transactions on Magnetics, 2014/8, Volume 50, Issue 8, PP 1-6, DOI 10.1109/TMAG.2014.2309933
